技术参数

• Package / Case 109-TFBGA
• Mounting Type Surface Mount
• Speed 48MHz
• Program Memory Size 256KB (256K x 8)
• RAM Size 48K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M3
• Data Converters A/D 12x12b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
• Connectivity I2C, SIO, SPI, UART/USART
• Peripherals DMA, LVD, WDT
• Supplier Device Package 109-TFBGA (9x9)
• Number of I/O 73
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• RoHS Status RoHS Compliant